Advanced packaging and 3D integration.

We support 3D IC system architecture, design, integration, and multiphysics signoff across foundries and design toolsets.

Recognition

DARPA ERIS Marketplace

DARPA ERIS Marketplace Awardable badge

Our solution has been competitively assessed by the Defense Advanced Research Projects Agency (DARPA) and has been deemed "awardable" in the Expedited Research Innovation System (ERIS) Marketplace, making it available to view and easily procurable by the Department of War.

Our partners

Who we build with

Together with our design partners, we are building the next generation of microelectronics systems-in-package to address US national security and economic leadership gaps.

Contact us

Discuss a pilot

Tell us about the design workflow, technical constraint, or outcome you want to improve.

We can arrange an MNDA or evaluation agreement before a technical exchange.